Chip Encapsulation Material Market, Global Outlook and Forecast 2022-2028

Product Id: 120125

SKU: 105144 Category: Publisher:

No. of Pages: 62
Published Date: Jun. 2022

Single User Licence

For Corporate License, Enquire Now!!!

Didn't Find Any Report?

Summary

This report contains market size and forecasts of Chip Encapsulation Material in Global, including the following market information:
Global Chip Encapsulation Material Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Chip Encapsulation Material market was valued at 24470 million in 2021 and is projected to reach US$ 33810 million by 2028, at a CAGR of 4.7% during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Substrates Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Chip Encapsulation Material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, Mitsui High-tec, Inc., Chang Wah Technology, Panasonic, Henkel and Sumitomo Bakelite, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Chip Encapsulation Material companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Chip Encapsulation Material Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Chip Encapsulation Material Market Segment Percentages, by Type, 2021 (%)
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Global Chip Encapsulation Material Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Chip Encapsulation Material Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
Global Chip Encapsulation Material Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Chip Encapsulation Material Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Chip Encapsulation Material revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Chip Encapsulation Material revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka

Table of Content

1 Introduction to Research & Analysis Reports
1.1 Chip Encapsulation Material Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Chip Encapsulation Material Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Chip Encapsulation Material Overall Market Size
2.1 Global Chip Encapsulation Material Market Size: 2021 VS 2028
2.2 Global Chip Encapsulation Material Market Size, Prospects & Forecasts: 2017-2028
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Chip Encapsulation Material Players in Global Market
3.2 Top Global Chip Encapsulation Material Companies Ranked by Revenue
3.3 Global Chip Encapsulation Material Revenue by Companies
3.4 Top 3 and Top 5 Chip Encapsulation Material Companies in Global Market, by Revenue in 2021
3.5 Global Companies Chip Encapsulation Material Product Type
3.6 Tier 1, Tier 2 and Tier 3 Chip Encapsulation Material Players in Global Market
3.6.1 List of Global Tier 1 Chip Encapsulation Material Companies
3.6.2 List of Global Tier 2 and Tier 3 Chip Encapsulation Material Companies
4 Market Sights by Product
4.1 Overview
4.1.1 by Type – Global Chip Encapsulation Material Market Size Markets, 2021 & 2028
4.1.2 Substrates
4.1.3 Lead Frame
4.1.4 Bonding Wires
4.1.5 Encapsulating Resin
4.1.6 Others
4.2 By Type – Global Chip Encapsulation Material Revenue & Forecasts
4.2.1 By Type – Global Chip Encapsulation Material Revenue, 2017-2022
4.2.2 By Type – Global Chip Encapsulation Material Revenue, 2023-2028
4.2.3 By Type – Global Chip Encapsulation Material Revenue Market Share, 2017-2028
5 Sights by Application
5.1 Overview
5.1.1 By Application – Global Chip Encapsulation Material Market Size, 2021 & 2028
5.1.2 Consumer Electronics
5.1.3 Automotive Electronics
5.1.4 IT and Communication Industry
5.1.5 Others
5.2 By Application – Global Chip Encapsulation Material Revenue & Forecasts
5.2.1 By Application – Global Chip Encapsulation Material Revenue, 2017-2022
5.2.2 By Application – Global Chip Encapsulation Material Revenue, 2023-2028
5.2.3 By Application – Global Chip Encapsulation Material Revenue Market Share, 2017-2028
6 Sights by Region
6.1 By Region – Global Chip Encapsulation Material Market Size, 2021 & 2028
6.2 By Region – Global Chip Encapsulation Material Revenue & Forecasts
6.2.1 By Region – Global Chip Encapsulation Material Revenue, 2017-2022
6.2.2 By Region – Global Chip Encapsulation Material Revenue, 2023-2028
6.2.3 By Region – Global Chip Encapsulation Material Revenue Market Share, 2017-2028
6.3 North America
6.3.1 By Country – North America Chip Encapsulation Material Revenue, 2017-2028
6.3.2 US Chip Encapsulation Material Market Size, 2017-2028
6.3.3 Canada Chip Encapsulation Material Market Size, 2017-2028
6.3.4 Mexico Chip Encapsulation Material Market Size, 2017-2028
6.4 Europe
6.4.1 By Country – Europe Chip Encapsulation Material Revenue, 2017-2028
6.4.2 Germany Chip Encapsulation Material Market Size, 2017-2028
6.4.3 France Chip Encapsulation Material Market Size, 2017-2028
6.4.4 U.K. Chip Encapsulation Material Market Size, 2017-2028
6.4.5 Italy Chip Encapsulation Material Market Size, 2017-2028
6.4.6 Russia Chip Encapsulation Material Market Size, 2017-2028
6.4.7 Nordic Countries Chip Encapsulation Material Market Size, 2017-2028
6.4.8 Benelux Chip Encapsulation Material Market Size, 2017-2028
6.5 Asia
6.5.1 By Region – Asia Chip Encapsulation Material Revenue, 2017-2028
6.5.2 China Chip Encapsulation Material Market Size, 2017-2028
6.5.3 Japan Chip Encapsulation Material Market Size, 2017-2028
6.5.4 South Korea Chip Encapsulation Material Market Size, 2017-2028
6.5.5 Southeast Asia Chip Encapsulation Material Market Size, 2017-2028
6.5.6 India Chip Encapsulation Material Market Size, 2017-2028
6.6 South America
6.6.1 By Country – South America Chip Encapsulation Material Revenue, 2017-2028
6.6.2 Brazil Chip Encapsulation Material Market Size, 2017-2028
6.6.3 Argentina Chip Encapsulation Material Market Size, 2017-2028
6.7 Middle East & Africa
6.7.1 By Country – Middle East & Africa Chip Encapsulation Material Revenue, 2017-2028
6.7.2 Turkey Chip Encapsulation Material Market Size, 2017-2028
6.7.3 Israel Chip Encapsulation Material Market Size, 2017-2028
6.7.4 Saudi Arabia Chip Encapsulation Material Market Size, 2017-2028
6.7.5 UAE Chip Encapsulation Material Market Size, 2017-2028
7 Players Profiles
7.1 Shennan Circuit Company Limited
7.1.1 Shennan Circuit Company Limited Corporate Summary
7.1.2 Shennan Circuit Company Limited Business Overview
7.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Major Product Offerings
7.1.4 Shennan Circuit Company Limited Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.1.5 Shennan Circuit Company Limited Key News
7.2 Xingsen Technology
7.2.1 Xingsen Technology Corporate Summary
7.2.2 Xingsen Technology Business Overview
7.2.3 Xingsen Technology Chip Encapsulation Material Major Product Offerings
7.2.4 Xingsen Technology Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.2.5 Xingsen Technology Key News
7.3 Kangqiang Electronics
7.3.1 Kangqiang Electronics Corporate Summary
7.3.2 Kangqiang Electronics Business Overview
7.3.3 Kangqiang Electronics Chip Encapsulation Material Major Product Offerings
7.3.4 Kangqiang Electronics Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.3.5 Kangqiang Electronics Key News
7.4 Kyocera
7.4.1 Kyocera Corporate Summary
7.4.2 Kyocera Business Overview
7.4.3 Kyocera Chip Encapsulation Material Major Product Offerings
7.4.4 Kyocera Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.4.5 Kyocera Key News
7.5 Mitsui High-tec, Inc.
7.5.1 Mitsui High-tec, Inc. Corporate Summary
7.5.2 Mitsui High-tec, Inc. Business Overview
7.5.3 Mitsui High-tec, Inc. Chip Encapsulation Material Major Product Offerings
7.5.4 Mitsui High-tec, Inc. Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.5.5 Mitsui High-tec, Inc. Key News
7.6 Chang Wah Technology
7.6.1 Chang Wah Technology Corporate Summary
7.6.2 Chang Wah Technology Business Overview
7.6.3 Chang Wah Technology Chip Encapsulation Material Major Product Offerings
7.6.4 Chang Wah Technology Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.6.5 Chang Wah Technology Key News
7.7 Panasonic
7.7.1 Panasonic Corporate Summary
7.7.2 Panasonic Business Overview
7.7.3 Panasonic Chip Encapsulation Material Major Product Offerings
7.7.4 Panasonic Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.7.5 Panasonic Key News
7.8 Henkel
7.8.1 Henkel Corporate Summary
7.8.2 Henkel Business Overview
7.8.3 Henkel Chip Encapsulation Material Major Product Offerings
7.8.4 Henkel Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.8.5 Henkel Key News
7.9 Sumitomo Bakelite
7.9.1 Sumitomo Bakelite Corporate Summary
7.9.2 Sumitomo Bakelite Business Overview
7.9.3 Sumitomo Bakelite Chip Encapsulation Material Major Product Offerings
7.9.4 Sumitomo Bakelite Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.9.5 Sumitomo Bakelite Key News
7.10 Heraeus
7.10.1 Heraeus Corporate Summary
7.10.2 Heraeus Business Overview
7.10.3 Heraeus Chip Encapsulation Material Major Product Offerings
7.10.4 Heraeus Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.10.5 Heraeus Key News
7.11 Tanaka
7.11.1 Tanaka Corporate Summary
7.11.2 Tanaka Business Overview
7.11.3 Tanaka Chip Encapsulation Material Major Product Offerings
7.11.4 Tanaka Chip Encapsulation Material Revenue in Global Market (2017-2022)
7.11.5 Tanaka Key News
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer

List of Tables & Figures

List of Tables
Table 1. Chip Encapsulation Material Market Opportunities & Trends in Global Market
Table 2. Chip Encapsulation Material Market Drivers in Global Market
Table 3. Chip Encapsulation Material Market Restraints in Global Market
Table 4. Key Players of Chip Encapsulation Material in Global Market
Table 5. Top Chip Encapsulation Material Players in Global Market, Ranking by Revenue (2021)
Table 6. Global Chip Encapsulation Material Revenue by Companies, (US$, Mn), 2017-2022
Table 7. Global Chip Encapsulation Material Revenue Share by Companies, 2017-2022
Table 8. Global Companies Chip Encapsulation Material Product Type
Table 9. List of Global Tier 1 Chip Encapsulation Material Companies, Revenue (US$, Mn) in 2021 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Chip Encapsulation Material Companies, Revenue (US$, Mn) in 2021 and Market Share
Table 11. By Type – Global Chip Encapsulation Material Revenue, (US$, Mn), 2021 & 2028
Table 12. By Type – Chip Encapsulation Material Revenue in Global (US$, Mn), 2017-2022
Table 13. By Type – Chip Encapsulation Material Revenue in Global (US$, Mn), 2023-2028
Table 14. By Application – Global Chip Encapsulation Material Revenue, (US$, Mn), 2021 & 2028
Table 15. By Application – Chip Encapsulation Material Revenue in Global (US$, Mn), 2017-2022
Table 16. By Application – Chip Encapsulation Material Revenue in Global (US$, Mn), 2023-2028
Table 17. By Region – Global Chip Encapsulation Material Revenue, (US$, Mn), 2021 & 2028
Table 18. By Region – Global Chip Encapsulation Material Revenue (US$, Mn), 2017-2022
Table 19. By Region – Global Chip Encapsulation Material Revenue (US$, Mn), 2023-2028
Table 20. By Country – North America Chip Encapsulation Material Revenue, (US$, Mn), 2017-2022
Table 21. By Country – North America Chip Encapsulation Material Revenue, (US$, Mn), 2023-2028
Table 22. By Country – Europe Chip Encapsulation Material Revenue, (US$, Mn), 2017-2022
Table 23. By Country – Europe Chip Encapsulation Material Revenue, (US$, Mn), 2023-2028
Table 24. By Region – Asia Chip Encapsulation Material Revenue, (US$, Mn), 2017-2022
Table 25. By Region – Asia Chip Encapsulation Material Revenue, (US$, Mn), 2023-2028
Table 26. By Country – South America Chip Encapsulation Material Revenue, (US$, Mn), 2017-2022
Table 27. By Country – South America Chip Encapsulation Material Revenue, (US$, Mn), 2023-2028
Table 28. By Country – Middle East & Africa Chip Encapsulation Material Revenue, (US$, Mn), 2017-2022
Table 29. By Country – Middle East & Africa Chip Encapsulation Material Revenue, (US$, Mn), 2023-2028
Table 30. Shennan Circuit Company Limited Corporate Summary
Table 31. Shennan Circuit Company Limited Chip Encapsulation Material Product Offerings
Table 32. Shennan Circuit Company Limited Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 33. Xingsen Technology Corporate Summary
Table 34. Xingsen Technology Chip Encapsulation Material Product Offerings
Table 35. Xingsen Technology Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 36. Kangqiang Electronics Corporate Summary
Table 37. Kangqiang Electronics Chip Encapsulation Material Product Offerings
Table 38. Kangqiang Electronics Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 39. Kyocera Corporate Summary
Table 40. Kyocera Chip Encapsulation Material Product Offerings
Table 41. Kyocera Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 42. Mitsui High-tec, Inc. Corporate Summary
Table 43. Mitsui High-tec, Inc. Chip Encapsulation Material Product Offerings
Table 44. Mitsui High-tec, Inc. Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 45. Chang Wah Technology Corporate Summary
Table 46. Chang Wah Technology Chip Encapsulation Material Product Offerings
Table 47. Chang Wah Technology Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 48. Panasonic Corporate Summary
Table 49. Panasonic Chip Encapsulation Material Product Offerings
Table 50. Panasonic Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 51. Henkel Corporate Summary
Table 52. Henkel Chip Encapsulation Material Product Offerings
Table 53. Henkel Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 54. Sumitomo Bakelite Corporate Summary
Table 55. Sumitomo Bakelite Chip Encapsulation Material Product Offerings
Table 56. Sumitomo Bakelite Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 57. Heraeus Corporate Summary
Table 58. Heraeus Chip Encapsulation Material Product Offerings
Table 59. Heraeus Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
Table 60. Tanaka Corporate Summary
Table 61. Tanaka Chip Encapsulation Material Product Offerings
Table 62. Tanaka Chip Encapsulation Material Revenue (US$, Mn), (2017-2022)
List of Figures
Figure 1. Chip Encapsulation Material Segment by Type in 2021
Figure 2. Chip Encapsulation Material Segment by Application in 2021
Figure 3. Global Chip Encapsulation Material Market Overview: 2021
Figure 4. Key Caveats
Figure 5. Global Chip Encapsulation Material Market Size: 2021 VS 2028 (US$, Mn)
Figure 6. Global Chip Encapsulation Material Revenue, 2017-2028 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Chip Encapsulation Material Revenue in 2021
Figure 8. By Type – Global Chip Encapsulation Material Revenue Market Share, 2017-2028
Figure 9. By Application – Global Chip Encapsulation Material Revenue Market Share, 2017-2028
Figure 10. By Region – Global Chip Encapsulation Material Revenue Market Share, 2017-2028
Figure 11. By Country – North America Chip Encapsulation Material Revenue Market Share, 2017-2028
Figure 12. US Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 13. Canada Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 14. Mexico Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 15. By Country – Europe Chip Encapsulation Material Revenue Market Share, 2017-2028
Figure 16. Germany Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 17. France Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 18. U.K. Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 19. Italy Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 20. Russia Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 21. Nordic Countries Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 22. Benelux Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 23. By Region – Asia Chip Encapsulation Material Revenue Market Share, 2017-2028
Figure 24. China Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 25. Japan Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 26. South Korea Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 27. Southeast Asia Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 28. India Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 29. By Country – South America Chip Encapsulation Material Revenue Market Share, 2017-2028
Figure 30. Brazil Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 31. Argentina Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 32. By Country – Middle East & Africa Chip Encapsulation Material Revenue Market Share, 2017-2028
Figure 33. Turkey Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 34. Israel Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 35. Saudi Arabia Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 36. UAE Chip Encapsulation Material Revenue, (US$, Mn), 2017-2028
Figure 37. Shennan Circuit Company Limited Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 38. Xingsen Technology Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 39. Kangqiang Electronics Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 40. Kyocera Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 41. Mitsui High-tec, Inc. Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 42. Chang Wah Technology Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 43. Panasonic Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 44. Henkel Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 45. Sumitomo Bakelite Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 46. Heraeus Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)
Figure 47. Tanaka Chip Encapsulation Material Revenue Year Over Year Growth (US$, Mn) & (2017-2022)

Report Summary

Customized Reports